Job Description

Summary:

The Senior Manufacturing / Process Engineer is responsible for developing, implementing, and improving manufacturing processes for electronic assemblies in a high-mix, low-volume environment. This role supports both the U.S. and Vietnam facilities, ensuring process repeatability, cost efficiency, and product quality across SMT, Through-Hole, and system assembly operations. The senior manufacturing process engineer will report directly to the VP of operations.

Goals:

• Build products and provide services with the highest Flexibility, Productivity, and Quality.
• Achieve total customer satisfaction through technical excellence and responsive engineering support.
• Ensure successful NPI launches through cross-functional collaboration, process validation, and data-driven feedback to design and quality teams.

Objectives:

1. Support production operations in the following categories:

a. Reduce downtime caused by engineering issues (programming, MPI errors, tooling, design, or line stoppage).

b. Improve quality yield through root cause analysis, corrective actions, and robust process setup.

c. Lead NPI and prototype builds, ensuring process readiness, documentation completeness, and manufacturability validation prior to production release.

2. Provide engineering services to meet customer needs and expectations in the following areas:

a. Design for Manufacturability (DFM).

b. Manufacturing Process Instruction (MPI) creation and maintenance.

c. Engineering Change Order (ECO) implementation.

d. Defect Reduction Team (DRT) meetings and follow-up actions.

e. Failure analysis and corrective action documentation.

f. Develop and validate new or modified processes, including process capability studies, DOE validation, and reflow/wave solder profile optimization

g. Other engineering requests as required by customers or management.

Job Description:

SMT / Through-Hole / 2nd Ops / 3rd Ops Process Support

1. Review daily SMT or build schedule to ensure process readiness.
2. Confirm all required items are complete and available prior to production:
3. Job package with full build documentation.
4. Manufacturing Process Instruction (MPI) reviewed and approved.
5. Routing definitions for data collection.
6. Validated reflow or wave solder profiles.
7. ECOs, deviations, or special instructions incorporated into the MPI and/or job package.
8. All required tooling available and verified.
9. Review pre-build DFM, document known defects, and hyperlink details in the MPI.
10. Lead cross-functional NPI kickoff meetings to review design requirements, risk areas, and special process considerations.
11. Document and track NPI issues and lessons learned for future builds.
12. Coordinate with Program Managers to resolve DFM showstoppers prior to build.
13. Analyze previous quality data, identify recurring defects, determine root causes, and implement corrective actions.
14. Design, order, and verify all required tooling (stencils, wave solder pallets, press-fit fixtures, conformal coat fixtures, etc.).
15. Maintain tooling logs, labeling, and readiness tracking within Omega Build Readiness.
16. Inspect and sign off first article setups for critical processes (stencil printer, reflow oven, wave solder, etc.) using the First Article Checklist.
17. Inspect initial boards after print and reflow for solder release, bridging, voids, and process anomalies. Document findings and sign off the First Article Report.
18. Provide on-the-floor training for operators and technicians regarding new processes, corrective actions, or observed deficiencies.
19. Support production by promptly responding to technical inquiries or line support issues.
20. Exercise full authority to stop the line if repeated defects or safety concerns are observed.

Quality Data Review & Root Cause Analysis

1. Review production data in Omega Data Collection, identifying root causes and corrective actions.
2. Review Daily, Weekly, and Customer Quality Reports to identify trends, recurring issues, or process gaps.
3. Provide structured analysis and report findings to Quality and Production (using 8D or equivalent methodology).
4. Document corrective actions and verify implementation during the next production run.
5. Present findings and improvement updates in internal and customer quality meetings.

Other Responsibilities:

1. Create and submit Post-Build DFM reports to Program Managers with improvement recommendations.
2. Implement and validate ECO changes per revision control procedures.
3. Perform and document detailed failure analyses for internal and customer returns.
4. Participate in process improvement projects and defect-reduction initiatives.
5. Provide customer-driven engineering services or special support requests.
6. Develop and deliver internal technical training for operators and peers.
7. Support ISO 9001 and AS9100 activities, including audits, documentation, and Work Instruction updates.

Qualifications:

• Bachelor’s degree in Manufacturing, Industrial, or Mechanical Engineering (or related discipline).
• 8–12 years of hands-on experience in electronics manufacturing (PCBA, box-build, system integration).
• Deep understanding of SMT, Through-Hole, and system assembly processes.
• Proficient in process validation, FAI, SPC, DOE, and yield improvement.
• Familiarity with FactoryLogix and related MES/ERP systems.
• Experience leading NPI builds and developing new assembly processes from prototype through production release.
• Familiarity with DFM/DFT analysis tools and PCB CAD systems (e.g., Altium, Valor, Mentor).
• Experience with Lean, Six Sigma, and structured problem-solving tools.
• Strong communication and analytical skills with the ability to multitask in a fast-paced environment.
• U.S. Citizen or Permanent Resident (ITAR requirement).

Compensation:

$120-$150K Annually

Benefits:

Medical

Dental

Vision

401K + Roth 401K

Vacation

Paid Holidays

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